Like every year, the symposium from 30th to 31st May 2017 in Heidelberg, organized by our partner Henkel, was well-attended by virtually all segments of the electrical and cable processing industry. Approximately 70 participants from the areas of automotive, sensor systems, connector manufacturers and electronics manufacturing were represented. These participants put forward some challenges of existing applications in their current products that we were able to resolve effectively and cost-efficiently with our “low pressure hotmelt technology with polyamide hotmelt adhesive”.
There were 2 days with extremely interesting customer meetings and project meetings. The latest processes and applications in the field of hotmelt technology, in particular for the electronics industry were the center of focus.
Kolb will also participate in this symposium next year.